Wafer Sleuth Benefits
Capture information on every wafer at every step
Wafer tracking examines all wafers across all steps of the fabrication process. Automated analysis of such comprehensive information exposes elusive sources of problems. Wafer Sleuth correlates wafer process position and sequence histories to in-line observational and final sort test and device parametric data. This gives engineering visibility into otherwise undetected yield or parametric variations caused by fabrication equipment.
Accelerate problem solving
Wafer tracking information reduces the amount of time needed to isolate causes of yield problems. Recorded test data (yield, electrical characteristics and inspection results) can be quickly plotted against wafer location/sequence data to reveal correlations. Engineers can then move quickly to address problems and stop any malfunctioning tools from producing more defective wafers.
Automatically track wafers and avoid misprocessing
Wafer Sleuth tracks individual wafers to build a database of each wafer's exact processing history. Knowing every wafers location or sequence through all process equipment provides valuable and rapid identification of sources of variability between wafers. Verifying each wafers ID before a process step is executed eliminates mix-ups and reduces the chance for misprocessing.
Reduce fabrication ramp-up time
Wafer Sleuth quickly identifies problem tools and correlates key process parameters relating to specific electrical and yield variation. This enables line performance of a new fab to be raised to production level faster. Statistical process control can be supplemented by wafer tracking data to reduce process variability and improve wafer yield and device electrical performance. With its ability to integrate the factory engineering database, Wafer Sleuth can significantly reduce learning cycles with new product introductions.
Determine extent of potential reliability issues
Wafer Sleuth can easily find production anomalies in equipment, which traditionally are discovered after extensive engineering studies, tests and designed experiments. The result is faster and more efficient detection of yield and potential reliability problems affecting either a small number of lots or many lots.
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