Wafer Sleuth Features

The Wafer Sleuth program is designed to be simple and quick. Typically, a user can enter a lot ID, select the desired parameters, perform the correlation and plot the results within ten seconds. The user can then do further analysis of those process steps showing a correlation or can print or e-mail the results for easy sharing with others.

Automated background routines augment this interactive analysis by calculating and reporting key correlations. Wafer Sleuth generates an internal web site display and e-mails reports customized for each engineer or manager.

All correlation patterns within a lot are automatically found, highlighted and ranked. On a daily basis, a summary of correlations is sent to each engineering user, customized to that user's needs (by device product, process tool, technology routing or other criteria). The following advanced interactive and automatic reporting modules determine the extent of a problem found on a single lot:

	•	Multi-lot analysis
	•	Multi-lot composite analysis
	•	Correlation database mining
	•	Integration of Wafer Sleuth with Spatial Signature Analysis of wafer map defect clusters
	•	Correlation of equipment-level process parameters
	•	Lot commonality analysis reports

These modules use similar rules to find correlation patterns and employ standard, robust, and non-parametric statistics where needed to distinguish specific process locations and conditions causing yield loss.

Automatic data flow monitoring
SPC methods produce automatic reports to monitor data flow from the various fab and test sources into Wafer Sleuth. This allows early detection of any interruption in a particular data source. The system administrator receives automatic alerts regarding any changes in the amount of data received or loading errors due to a change in input format. Alarms also warn of high CPU usage or excessive disc consumption.

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